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Release No: 652-95
December 11, 1995


The Department of Defense's Advanced Research Projects Agency (ARPA) today announced the names of the 17 projects being funded under the Microwave and Analog Front End Technology (MAFET) program. Funding awarded to date exceeds $105 million, with one project amount yet to be finalized.

The MAFET program will develop the technologies required to extend the performance of radio-frequency systems while correspondingly reducing the cost to produce them. It will also dramatically reduce the cost to design these systems while increasing the design capability. The program emphasizes millimeter wave systems and technology for the radio-frequency systems used by the military for radars, smart weapons, electronic countermeasures, secure communications and accurate combat identification. The MAFET program will insure that future systems are affordable, highly portable, and can gather, process and transmit information quickly, accurately and reliably. These systems are crucial to providing the warfighter with dominant battlefield awareness.

One thrust of the MAFET program is to develop a comprehensive environment for low-cost, rapid design of the microwave and millimeter wave microwave circuit assemblies (MCA) and related technology. Contractors for this first thrust are:

Microwave Design Environment Consortium consisting of: Texas Instruments (Dallas, Texas), Hughes (Los Angeles, Calif.), TRW (Redondo Beach, Calif.), Raytheon (Tewksbury, Mass.), Cadence (San Jose, Calif.), Compact Software (Paterson, N.J.), HP EEsof (Santa Rosa, Calif.), working on MAFET Design Environment. This consortium will develop a computer-aided engineering design environment which will reduce by three times the design time and cost to develop MCAs. These barriers are hindering widespread insertion of Microwave and Millimeter Wave Monolithic Integrated Circuit (MMIC) technology into DoD and commercial systems. ($57,000,193; awarded 11/2/95)

University of Colorado (Boulder, Colo.), working on Novel Methods for Simulation of Large Electromagnetic Structures. University of Colorado will develop three simulation methods which will reduce the time and amount of memory required to run large electromagnetic simulations. ($315,590; awarded 7/26/95)

The program's second thrust includes a range of contracts targeted at specific, well-defined problems in the areas of fabrication, devices and circuits, packaging and passive com-ponents, millimeter wave test, and multi-chip assemblies. Contractors for the second thrust are:

Cascade Microtech Inc. (Beaverton, Ore.), working on Next-Generation Millimeter Wave Probes. Cascade will develop and commercialize a technology that solves all millimeter wave probe needs through the year 2000. ($577,853; awarded 8/30/95)

Electromagnetic Sciences Technologies Inc. (Norcross, Ga.), working on Development of Miniaturized Ferrite Circulators Supportive of MMIC Applications. EMS will reduce the size and cost of microwave and millimeter wave ferrite circulators and demonstrate their ease of integration with microwave front-end modules. ($1,067,125; awarded 8/8/95)

Hittite Microwave (Woburn, Mass.), working on Large-Scale Integration of Advanced Monolithic Microwave Integrated Circuits (MMICs) for Microwave Frequency Synthesizer Applications Hittite will develop advanced mixed signal MMIC chip sets to demonstrate highly integrated, low-cost, miniature and ruggedized frequency synthesizers. ($3,500,000; awarded 9/29/95)

ITT Avionics Division (Clifton, N.J.), working on Low Cost Common MMIC Components for Affordable, New and Upgraded Electronic Warfare Transmitter Arrays. ITT will develop a set of low-cost, broadband, high-power, high-efficiency chips and multi-chip assemblies for electronic warfare transmitter arrays. ($2,563,164; awarded 8/15/95)

Lockheed Martin Electronics Laboratory (Syracuse, N.Y.), working on Millimeter Wave Indium Phosphide (InP) High Electron Mobility Transistor (HEMT) MMICs with 70 per cent (radio frequency) Yield. Lockheed Martin will develop a 0.1 micron InP HEMT MMIC process that will make high-performance InP MMICs affordable for adverse-weather missile seekers and communications systems. ($1,499,297; awarded 9/18/95)

Lockheed Martin (Baltimore, Md.), working on High Indium Low-cost Field Effect Transistor (FET) Materials on Gallium Arsenide (GaAs) for MMICs. Lockheed Martin will develop a materials process producing InP-like, or better, device performance at GaAs chip cost. ($1,011,194; awarded 8/14/95)

Lockheed Martin Government Electronic Systems (Moorestown, N.J.), working on 50 Watt Plastic High Density Interconnect (HDI) Module. Lockheed Martin will reduce the cost of phased array transmit/receive modules by replacing the costly ceramic substrates with an advanced plastic HDI packaging technology. ($3,000,000 total, $329,293 for first phase; awarded 9/18/95)

Lockheed Martin Electronics Laboratory (Syracuse, N.Y.), working on Millimeter Wave Load-Pull Test Station. Lockheed Martin will develop an automated W-band load-pull test station that measures, with greater speed and accuracy, the performance of power transistors and MMICs over a broad range of complex impedance loads, virtually eliminating the need for multiple MMIC design/fabrication/test cycles. ($830,295; awarded 8/23/95)

Lockheed Martin Electronics Laboratory (Syracuse, N.Y.), working on Known-Good Die Intelligent Test Station. Lockheed Martin will develop and productize matched radio-frequency probe technology which will enable high-speed, on-wafer testing of very-high-power amplifier MMICs with off-chip-matching-networks at full power, ensuring known-good die for low-cost, high volume Department of Defense (DoD) module production. ($773,400; awarded 8/23/95)

M/A-COM Inc. (Lowell, Mass.), working on The Independent Merchant Foundry Source for Low Cost Multi-Chip Assemblies (MCAs) for DoD Application. M/A-COM will establish a low cost source for microwave MCAs which will provide: a 3x reduction in DoD system costs; easy access design tools and standards; choice of integration technologies; reduced non-recurring engineering (NRE); and reduced cycle time. ($4,999,444; awarded 9/1/95)

Northrop Grumman (Rolling Meadows, Ill.), working on Adaptable MMIC - An Innovative and Affordable Approach to MMIC Design. Northrop Grumman will develop and use micro-wave millimeter wave device arrays (MMDAs) to achieve a substantial reduction in the fabri-cation time, fabrication cost and redesign time of MMICs using MMDAs, as compared with the conventional approach for MMIC design and fabrication. ($2,467,035; awarded 9/14/95)

Raytheon/TI Joint Venture (Tewksbury, Mass./Dallas, Texas), working on Technologies for Wideband Integrated Apertures and Ground Based AESAs. Raytheon/Texas Instruments will refine and demonstrate the usefulness of three advanced processes to improve the performance and reduce the cost of wideband integrated aperture and X-band ground-based array systems. (selected; not yet awarded)

Texas Instruments (Dallas, Texas), working on Enhancement of a Source for MMICs and MCAs. Texas Instruments will dramatically reduce MCA cost, size, and weight through the development of embedded transmission line MMICs and advanced multi-layer interconnect materials and circuits. ($7,200,000; awarded 9/14/95)

TRW Inc. (Redondo Beach, Calif.), working on Comprehensive Millimeter Wave Effort. TRW will develop and demonstrate new ways to fabricate and package millimeter wave MMICs made from gallium arsenide and indium phosphide. TRW will also develop new processes and procedures for automated assembly of millimeter wave multi-chip assemblies. ($21,888,616; awarded 8/15/95)

Westinghouse Electric Corporation (Baltimore, Md.), working on Heterojunction Bipolar Transistor (HBT) High Power Amplifier (HPA) MMICs. Westinghouse will develop design and process technologies to improve the reproducibility and the reliability of HBT high power amplifier MMICs making them cost-effective for use in advanced microwave and millimeter-wave system applications. ($1,957,116; awarded 8/18/95)

The MAFET program is under ARPA management with the United States Army, Navy and Air Force sharing in the technical guidance and support of the program. Contracts and agreements are being awarded by: Advanced Research Projects Agency, Arlington, Va.; U.S. Army Research Laboratory, Ft. Monmouth, N.J.; U.S. Army Intelligence Center, Ft. Huachuca, Ariz.; Naval Research Laboratory, Washington, D.C.; Navy Yard, Washington, D.C.; Naval Air Warfare Center - Aircraft Division, Warminster, Penn. and the U.S. Air Force Wright Laboratory, Wright-Patterson Air Force Base, Ohio.

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