The president issued an authorization on Dec. 21, 2021 to utilize Defense Production Act (DPA) Title III to strengthen and expand the domestic industrial base for radiation-hardened and strategic radiation-hardened microelectronics.
DoD and many commercial industries require trusted and reliable radiation-hardened and strategic radiation-hardened microelectronic components to support strategic and space missions. These components ensure the functionality of these systems in high radiation environments such as ambient space and in proximity to nuclear detonations. They need to withstand short bursts of intense radiation, high temperatures, and, in some cases, extreme shock and vibration in order to meet mission requirements. DoD anticipates an increasing demand for radiation-hardened and strategic radiation-hardened microelectronic components to support programs such as satellites and nuclear modernization efforts. Maintaining and expanding domestic capabilities for the production of radiation-hardened and strategic radiation-hardened microelectronics components is of vital national importance.
The department is working with key stakeholders to address this industrial base shortfall as quickly as possible. More information about the DPA Title III program is available here, and a link to the presidential determination can be found here.